Henkel-Bergquist: Advanced thermal management for critical applications
Henkel-Bergquist high-performance thermal interface solutions
Today’s high-power electronics demand more than just functionality — they need reliability under thermal stress. Henkel’s Bergquist thermal interface materials are designed to deliver exceptional heat dissipation with minimal impact on assembly processes. Discover two top solutions for different needs and applications.
Bergquist Hi-Flow THF 1600P
The Hi-Flow THF 1600P utilizes phase-change technology that activates rapidly under device heat, eliminating the need for additional adhesive films. Its printability and positional stability simplify assembly and manufacturing processes.
Compared to conventional tapes or greases, this thermal interface material provides lower thermal resistance in operation and enhanced reliability of electronic modules, ensuring excellent electrical insulation and mechanical stability thanks to the polyimide support liner.
Bergquist GAP FILLER TGF 4500CVO
TGF 4500 is a two-component fluid solution that self-levels perfectly even on uneven surfaces. Its conductivity of 4.5 W/m·K ensures gap-free interfaces, eliminating critical thermal hotspots in automotive and telecom systems.
Unlike traditional pads, it eliminates the need for high pressure, reducing the risk of mechanical stress on PCBs.
Optimized for long operating hours, with low heat emission and high reliability, the T2821IR LED is the ideal solution for next-generation detection and monitoring projects.
Contact us for more technical information, product data sheets, or application support.
