Bergquist SIL PAD TSP K1300

In recent years, following a constant miniaturization of electronic components, the thermal management is assuming ever greater importance, as electronic systems are integrating a large number of components in increasingly confined spaces. More than ever it is important to carefully choose efficient components for heat control.

Welt Electronic relies on Henkel-Bergquist, a world leader in the production of thermal interfaces and insulated metal substrates to solve heat conduction problems on electronic boards or assemblies.

Henkel’s LOCTITE®Bergquist® solutions distributed by Welt Electronic guarantee the neutralization of the heat-generating components, offering a condition of “relief” from the stress caused by thermal cycling, and long-term stability within the components themselves. Without effective thermal management, in fact, you can easily run into a decrease in performance, lower reliability, and the possibility that the product degrades much faster.

Among the wide range of solutions offered, there is BERGQUIST SIL PAD TSP K1300, developed in collaboration with DuPont.

It is a type of gap filler with is a beige, silicone-based thermal interface gap pad material with a Kapton film with good cut-through properties.
The material it is made of is cheap but durable, allowing the product to be used even as a replacement for generally more fragile and expensive ceramic insulators.

FEATURES:
• Tough dielectric barrier against cut-through;
• High performance films;
• Thermal impedance: 0.41°C -in2/W (@50 psi);
• Replaces ceramic insulators