GAP PAD TGP HC3000

Welt Electronic presents the successful case study Henkel-Bergquist, leader in thermal management solutions.

CUSTOMER REQUIREMENTS: for a new electronic control unit (ECU) design that includes a large processor IC, the customer needs a Gap Pad with excellent heat dissipation, as well as minimum outgassing, guaranteeing a correct functioning of an Industrial Autonomous Guided Vehicle (AGV).

HENKEL-BERGQUIST SOLUTION: with thermal performance of 3,0W/mK and an exceptional softness, the Gap Pad TGP HC3000 generates very low stress on the IC. The low outgassing formulation protects sensitive components from residue interference.

Easy handling of material in production environment and excellent reliability with very high thermal performances even in long term, make Henkel-Bergquist’s TGP HC3000 Gap Pad series the solution that perfectly suits the customer need.

FEATURES:

– Carrier type: Fiberglass

– Color: Blue

– Flame rating: V-0

– Operating temperature: -60°C ~ +200°C

– Standard thickness: 0.508 ~ 3.175 mm

– Technology: Silicone

– Thermal Conductivity: 3.0 W/mK

– Young’s Modulus, ASTM D575: 110.0 KPa (16.0 psi)