Henkel-Bergquist GAP PAD TGP HC5000
For an excellent high dissipation of electronic devices, release on the efficiency of Henkel-Bergquist GAP PAD TGP HC5000.
TGP HC5000 is a silicone and fiberglass reinforced material with a thermal conductivity rating of 5W/m-K and highly conformable, specifically designed for high performance applications.
TGP HC5000 is extremely soft, flexible and it easily conforms to rough and irregular surfaces, allowing for exceptional thermal performance at low pressures.
The GAP PAD TGP HC5000 has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both sides for easy handling.
Available in standard sheets or customized cut according to the needs of each customer.
APPLICATION: telecommunications, ASICs and DSPs, consumer electronics, thermal modules for heat sinks
